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The Maxtor AP-12 Thermal Pad is a high-performance silicone thermal interface designed to transfer heat efficiently from electronic components to compatible heatsinks. Featuring 14.8W/m·K thermal conductivity and a 2.0mm thickness, this 120 × 20mm strip is suitable for compatible GPU VRAM, VRM, SSD, motherboard, and laptop cooling applications. Its electrically insulating construction and cut-to-fit design make it a practical solution for thermal maintenance and electronics repair.


$7.00 
  • Brand: Maxtor
  • SKU: AP12-120*20-2MM
  • Shipping: 
  • Return Policy: We accept returns within 7 days of delivery for items that are unused, in their original packaging, and include all accessories. Some products may be non-returnable; please refer to the product page for specific details. To initiate a return, contact our Customer Support.


Product Description


Improve thermal management with the Maxtor AP-12, designed to provide efficient heat transfer between electronic components and compatible cooling surfaces. Its long, narrow format is suitable for elongated contact areas and can be trimmed to match the required component dimensions.

Key Features

  • 14.8W/m·K Thermal Conductivity: Supports efficient heat transfer to compatible cooling surfaces.

  • 2.0mm Precision Thickness: Designed for assemblies requiring a 2.0mm thermal interface.

  • 120 × 20mm Strip: Slim rectangular format for elongated thermal contact areas.

  • Electrically Insulating: Non-conductive silicone material for use around sensitive electronics.

  • Flexible Silicone Construction: Helps accommodate minor surface irregularities under appropriate mounting pressure.

  • Cut-to-Fit Design: Can be trimmed to match compatible component dimensions.

  • Wide Compatibility: Suitable for compatible GPU VRAM, VRM, M.2 SSDs, chipsets, memory modules, and laptop components.

  • Clean Installation: Pre-formed pad that can be cut and positioned without spreading thermal grease.

  • Operating Temperature: Manufacturer-listed range of −50°C to +250°C.

  • Non-Curing Material: Designed to remain a flexible thermal interface rather than hardening into a rigid compound.

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